A New Beginning-Genesis Hiring for Semiconductor Process Engineer PECVD, Reactive Ion Etch RIE, Wafer Bonding Job at Remote Full Time

Semiconductor Process Engineer in PECVDor Reactive Ion Etch (RIE) or Wafer Bonding

Preference given to those willing to relo to, reside in, near Brevard County FLA. AND the Ability to attain or already possess a US government Security Clearance (SECRET/TS/SCI)

Minimum Education – Bachelor’s Degree, With Experienced and versed with semiconductor processes with any combination as a Process Engineer in OR EXPERTIsE in at least 1 area of;

Lead PECVD, Senior Reactive Ion Etch (RIE), Sr Spec, Senior Wafer Bonding

90 – 160k base, no state INCOME TAX

Bachelor’s Degree in Electrical Engineering, Chemical Engineering, Material Science, Physics and

3+ years of Semiconductor Fabrication Clean Room Experience

Preferred Additional Skills:

5+ years of Semiconductor Fabrication Clean Room Experience

Experience with LEAN and 6 Sigma cost savings and process improvement techniques and efficiencies

Experience with Tool qualification, selection, training, and on-boarding.

Any combination of or specific experience in, as a;

Lead PECVD Process Engineer, ownership of process development, sustainment, improvement, and analysis for “unique utilization” of semiconductor PECVD process tools for both conductive and non-conductive material depositions. The role will place you within a multidisciplinary team of Scientists, Engineers, Specialists, and Technicians focused on creating “one of a kind” novel devices and processes for our customers. The ideal candidate will be responsible for creating Design of Experiments (DOE), tracking process flow with Statistical Process Controls (SPC), reporting on Failure Review Boards (FRB) and recommending Root Cause Corrective Actions (RCCA) along with leading and mentoring a technical team. This opportunity is at the core of a new technology area and is looking for innovative researchers and operators to develop, grow, and transition from lab development to a high-volume environment.

Essential Functions:

Senior Professional with strong knowledge in Semiconductor PECVD process development, sustainment, and analysis.

Manage complex semiconductor fabrication projects supporting multiple builds at the same time, developing processes, performing failure analysis investigations, RCCAs, and usage of SCP to monitor and improve process yield.

Select and develop materials and equipment for processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.

Create process control documentation and mentor/lead other personnel on processes.

Ability to document, communicate, and present technical topics/recommendations/issues/concerns to internal and external customers.

Qualifications:

3+ years of relevant experience in PECVD Process Development and Execution.

Graduate Degree Electrical Engineering, Chemical Engineering, Material Scientist or Physics with 2+ years of relevant experience in PECVD Process Development and Execution.

Senior Reactive Ion Etch (RIE) Process Engineer, take ownership of process development, sustainment, improvement, and analysis for “unique utilization” of semiconductor Reactive Ion Etch (RIE) process tools. The role will place you within a multidisciplinary team of Scientists, Engineers, Specialists, and Technicians focused on creating “one of a kind” novel devices and processes for our customers. The ideal candidate will be responsible for creating Design of Experiments (DOE), tracking process flow with Statistical Process Controls (SPC), reporting on Failure Review Boards (FRB) and recommending Root Cause Corrective Actions (RCCA) along with leading and mentoring a technical team. This opportunity is at the core of a new technology area and is looking for innovative researchers and operators to develop, grow, and transition from lab development to a high-volume environment.

Essential Functions:

Senior Professional with strong knowledge in Semiconductor RIE process development, sustainment, and analysis.

Manage complex semiconductor fabrication projects supporting multiple builds at the same time, developing processes, performing failure analysis investigations, RCCAs, and usage of SCP to monitor and improve process yield.

Select and develop materials and equipment for processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.

Create process control documentation and mentor/lead other personnel on processes.

Ability to document, communicate, and present technical topics/recommendations/issues/concerns to internal and external customers.

Work with general oversight and lead technical team of up to 4 additional engineers/specialists/technicians.

Qualifications:

3+ years of relevant experience in Reactive Ion Etch (RIE) Process Development and Execution.

Graduate Degree Electrical Engineering, Chemical Engineering, Material Science or Physics and 2+ years of relevant experience in RIE Process Development and Execution.

Sr Spec, Senior Wafer Bonding Process Engineer, working alongside a talented team of professionals with a focus on establishing, monitoring, and maintaining reproducible wafer bonding processes and implementing yield enhancements with the ability to identify complex problems and implementing solutions. The candidate must have experience working with both manual and automated wafer bonding tools and understands principles of achieving wafer-to-wafer bond alignments with better than 0.5 um accuracies. The ideal candidate will have the ability to perform routine tool maintenance and maintain the wafer bonding tools. The candidate must have a strong background in measuring and analyzing wafer bond strength. The candidate will also communicate technical results and will support internal peer design reviews.

Essential Functions:

Senior Professional with strong knowledge in wafer bonding process optimization and in depth understanding of fusion, hybrid, and direct bonding technologies

Experience using automated wafer bonding tools to perform wafer-to-wafer and die-to-wafer bonding

Qualifies wafer bonding processes on new tools.

Performs design of experiments (DOE) to improve bond strength, eliminate bond voids, and maximize bond energy

Perform process centering to maximize yield of bonded wafers and minimize deviations from nominal and actual bond line thickness

Continually monitors bonding metrics to account for process drift and perform root cause corrective analysis (RCCA) when insufficient bond strength or bond voids occur

Monitors the wafer bonding process by responding to in-line issues and dispositions of production wafers.

Coordinates the scheduling of process qualifications and equipment down time with manufacturing or equipment engineering.

Uses software to analyze data, identify trends to make decisions about processing product.

Makes adjustments when process parameters are exceeded and monitors process parameters when tools return from maintenance.

Qualifications:

A Bachelor’s Degree with 10 years of experience will also be considered.

Experience with Software Data Analysis software (Matlab, Spotfire, Minitab, JMP, etc.)

Troubleshooting equipment or process failures

Preferred Additional Skills:

Master’s Degree or PhD in Chemical, Mechanical, Electrical, Materials Science, Physics, or Industrial Engineering with a minimum of 5 years of industrial experience.

Prior experience with metrology tools such as atomic force microscopes and scanning acoustic microscopes to analyze surface roughness and bond voids respectively

Understanding of statistical methods and design of experiments

Presentation and technical writing skills , Understanding of root cause corrective action (RCCA)

Job Type: Full-time

Pay: $90,000.00 – $160,000.00 per year

Benefits:

• 401(k)
• 401(k) matching
• Dental insurance
• Employee assistance program
• Employee discount
• Flexible schedule
• Flexible spending account
• Health insurance
• Health savings account
• Life insurance
• Paid time off
• Parental leave
• Professional development assistance
• Referral program
• Relocation assistance
• Retirement plan
• Tuition reimbursement
• Vision insurance

Experience level:

• 3 years

Schedule:

• 8 hour shift

Work setting:

• Remote

Work Location: Remote